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Press Releases

Infineon

April 27, 2026
Infineon provides MEMS technology for Valeos ground projection module based on laser beam scanning presented at 2026 Auto Beijing

April 22, 2026
AI with impact: Infineon wins AI Impact Award 2026 for delivering measurable business value in semiconductor manufacturing

April 22, 2026
Quantum chips: Infineon contributes industrialization know-how to European quantum pilot lines

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onsemi

April 28, 2026
onsemi and Geely Expand Strategic Collaboration to Elevate the Driving Experience

April 27, 2026
onsemi and NIO Expand Strategic Collaboration to Accelerate Next-Generation 900V EV Platforms

March 31, 2026
onsemi Powers Sineng Electrics Advanced Solar and Energy Storage Solutions

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Vishay

April 29, 2026
Vishay Specialty Thin Film Introduces Thin Film Metallized Submount Platform

April 22, 2026
Vishay Intertechnology 200 V FRED Pt? Ultrafast Rectifiers Deliver High Current Ratings Up to 15 A in New DFN6546A Package

April 15, 2026
Vishay Intertechnology IHLP? Inductor in 1212 Case Size Saves Space and Delivers High Efficiency for Commercial Applications

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ST

April 28, 2026
STMicroelectronics brings always-on vision to next-generation personal electronics with new ultralow-power image sensors

April 23, 2026
STMicroelectronics Reports Q1 2026 Financial Results

April 23, 2026
STMicroelectronics to host investor call on the LEO opportunity

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Renesas

April 24, 2026
Renesas Announces Consolidated Forecasts

April 24, 2026
Renesas Reports Financial Results for the First Quarter Ended March 31, 2026

April 10, 2026
Notice Concerning Withdrawal of Shelf Registration Statement and Filing of New Shelf Registration Statement for Issuance of New Shares or Disposal of Treasury Shares

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AOS

April 30, 2026
Alpha and Omega Semiconductor Unveils SmartClamp Protected DrMOS Family for AI Servers and High-End GPUs

April 14, 2026
Alpha and Omega Semiconductor to Announce Fiscal Third Quarter Financial Results on May 6, 2026

April 14, 2026
Alpha and Omega Semiconductor Announces Commencement of Production of Intelligent Power Module (IPM5) Products at Kaynes Semicon Inaugural Opening in Sanand, Gujarat

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Toshiba

May 21, 2026
Toshiba Starts Shipping Test Samples of 1200V Trench-Gate SiC MOSFET that will Enhance Efficiency in Next-Generation AI Data Centers

May 14, 2026
Toshiba Starts Sample Shipments of New SmartMCD Series IC with Built-in MOSFETs for Motor Drive

May 07, 2026
Toshiba Releases 2:1 Multiplexer / 1:2 Demultiplexer Switches Supporting High-Speed Differential Signals such as PCIe?6.0 and USB4? Version 2.0

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Nexperia

May 22, 2026
Statement from Nexperia

May 20, 2026
Company message

February 11, 2026
Update on company developments

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Rohm

April 28, 2026
 ROHM Launches an Ultra-Compact Wireless Power Chipset for Wearables

April 21, 2026
 ROHM Develops 5th Generation SiC MOSFETs with Approx. 30% Lower On-Resistance at High Temperatures

March 31, 2026
 ROHM has added New Lineup of 17 High-Performance Op Amps Enhancing Design Flexibility

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Microsemi

April 28, 2026
Microchip Expands its Family of Post-Quantum Ready Root of Trust Controllers for Next Generation Systems

April 27, 2026
Microchip Increases Manufacturing Capacity of its Hydrogen Masers

April 23, 2026
New Plug-In Timing Module Delivers Precise, Reliable Synchronization for Data Centers and 5G Networks to Meet the Demands of AI and Next-Generation Connectivity

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